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Apr 22-25

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Jun 26 - 28
Applications - Wafer-Level-Capping

Glass Capping Service

» encapsulation of active areas of micro sensors with a micro structured glass cap

» encapsulation in clean room environment, early protection of sensitve structures from contamination, stress and humidity

» excellent usability e.g. for imagers, photo detectors, MEMS and MOEMS

» qualified product for PDIC application in HD-DVD market

» THS 85°C/85%, 1000h passed

» TCT –55°C/125°C, 500 cycles passed

COB packaging of capped wafers
» more information in our Downloads section