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Santa Clara, CA, USA
Aug 2-3


Grenoble, France
Sept 20-22
Booth 12
Applications - Lithoglas Structured Passivations

Hermetic Sealing of Chip Surface on Wafer-Level
Lithoglas micro-structured coatings can be used as surface passivation for the hermetic sealing of sensitive chip areas. Lithoglas coatings are excellent moisture barriers applied on wafer-level under clean-room conditions, enabling low-cost plastic-molded COB packaging with high reliability.


Improved reliability

» immediate protection of active circuitry
» Lithoglas is a long-term stable moisture barrier
» reduced stress - matched CTE of glass to silicon


Reduced package size

» chip scale an low profile packages feasible
» replacement solution for TO packages
» SMD-compatibility


Reduced packaging cost

» highly reliable mold packages feasible
» glass sealing on wafer-level

» more information in our Downloads section