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Applications - Substrates for WLCSP (Wafer Level Chip Size Package)

Replacement of polymer dam by glass
Lithoglas micro-structred glass substrates are manufactured on wafer-level and can be integrated beneficially in existing packaging technologies to improve reliability and device lifetime while reducing the package dimension.

Improved reliability

» glass dam is a moisture barrier
» reduced stress - matched CTE of glass

Reduced package height

» glass dam thickness of 5 to 20 um sufficient
» reduced glass lid thickness possible

Optical integration features

» optical coatings, e.g. AR, IR
» opaque aperture layers
» lense integration (under development)

» more information in our Downloads section