Meet us:


Santa Clara, CA, USA
Aug 2-3


Grenoble, France
Sept 20-22
Booth 12
European MEMS Summit 2015

VENUE

ATAHOTEL FIERA, Via Keplero 12, 20016 - Pero (Milan)
17. - 18. September 2015
Further information can be found on the summit homepage


CONFERENCE - EXHIBITION - NETWORKING


With the increased use of MEMS devices in a diverse and growing list of products – telephones, cars, wearables, etc. – the development of MEMS technology has become critical to the evolution of microelectronics products. The European MEMS Summit 2015 will offer exciting opportunities to learn about the most recent advances in the technology from the world’s leading experts in the domain.

Considerable growth in the use of MEMS technology has had a significant impact on the microelectronics industry world-wide. In addition to top MEMS technologists, the European MEMS Summit 2015 will host numerous market experts to speak about cost models, business strategies and market outlooks.

With the top MEMS producers located in Europe, Milan is a fitting location to bring international experts and industry executives together to meet and network. The event will offer numerous opportunities for attendees to meet one another and further their business interests.

The European MEMS Summit was born from a need expressed by the industry to have a high-level event platform to present ideas and exchange viewpoints on MEMS technologies, manufacturing and business challenges. SEMI, already active in MEMS and with a proven track record in microelectronics, has answered this need by reinforcing its dedication to MEMS and by launching a new flagship event to focus on MEMS: the European MEMS Summit.


Lithoglas borosilicate thin films for MEMS integration

Lithoglas is show-casing its leading edge glass deposition technology with multiple uses in building MEMS devices. Next to being a hermetic moisture barrier Lithoglas thin films may be employed in anodic bonding - e.g. replacing other hermetic bonding techniques like glass-frit or eutectic bonding in MEMS capping. Furthermore, other materials (e.g. silicon) can be made fit for anodic bonding by applying a thin glass to their surface increasing the quality of the devices.

Lithoglas aims to strengthen its brand awareness and widen its customer base in the MEMS market.
Our participation is funded by the European Union.

We are looking forward to see you in Italy!